Fraunhofer IZM
Fraunhofer IZM

Germany: Berlin

Overview

Fraunhofer IZM specializes in industry-oriented applied research. Fraunhofer IZM develops assembly and interconnection technology, also known as electronic packaging. Almost invisible and undervalued by many, electronic packaging is at the heart of every electronic application. Our technologies connect the individual components, protect components and devices from vibration and moisture, and reliably dissipate heat. Fraunhofer IZM thus ensures that electronic devices continue to function reliably in even the harshest conditions. Modern packaging technologies make developing smaller and smaller products possible. We process ICs thinner than a sheet of paper. The institute, founded in 1993, has a staff of nearly 400 and disposes of a lab area of more than 8,000 sqm. More than 80 percent of our turnover in 2019 was earned through contract research.
SYSTEM INTEGRATION

Wafer-Level Packaging Line
Fraunhofer IZM operates two process lines (cleanroom class 10 – 1000) in Berlin (975 m²) and Dresden (ASSID, 1000 m²), that offer our customers various wafer-level packaging services from development stage to prototyping and small volume production. Different substrate materials (e. g. silicon, III/V, ceramic and glass) and wafer sizes (4” –12”) can be processed. Project and process work on both lines is executed in compli-ance with ISO 9001:2015 management standards.

Process Modules:

Cu-TSV integration (via-middle and via-last-processes)
Silicon and SiC plasma etching – DRIE (TSV, cavities)
Thin-film deposition (sputter, CVD, photolithography, reactive ion beam etcher)
PECVD process chamber (200 / 300 mm) for the deposition of TEOS oxide, Silane oxide and Silane nitride
High-density thin-film multilayer (Cu / polymer RDL)
Wafer-level bumping (Cu-Pillar, SnAg, Ni, Au, In, AuSn)
Wafer thinning und thin wafer dicing (blade, laser grooving….

Feasibility studies

Product Development Consultation

Process and Product Development

Manufacturing & Prototyping

Testing, Qualification, Reliability

Training

Lab collaborations

. Yes. service.

Sectors
Aeronautics & space - Automotive - Electronics - Energy - Environment - Healthcare - Manufacturing - Medical devices - Process Manufacturing - Telecommunication - Textiles
Technology
Smart Manufacturing / Industry 4.0 - Process industry (processing of novel materials, structures, etc.) - High performance computing / cloud-based simulation services - High-performance production (flexibility, productivity, precision and zero defect) - High-performance, high precision processing - Electronic and optical functional materials - Micro- and Nano-Eletronics - Quantum technology - Optoelectronics (optical networks, optical sensors) - Outsides system connectivity (communication, data transfer, wifi) - Power electronics - Heterogeneous integration/embedded systems - Optical fibres - Optical components & systems - Advanced sensor technologies
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